Program
09:00-09:20
Introduction
- Dr. Adriaan Spierings, Swissmem & Cemal Aydogan, Hitachi Energy AG
- Alexandre Pauchard, CSEM
- Matthieu Aubert, invest Neuchâtel
- Yasin Ekinci, PSI
09:20-10:20
Session 1: Geopolitical Aspects impacting the semiconductor industry
- Securing Semiconductor Exports under Swiss and Global Trade Rules - Seraina Frost, SECO
- Securing the Global Supply Chain in the Era of Increased Geopolitical Competition - Ivan Zaccagnini, ETH-CSS
- Military trends and needs for semiconductor solutions - Thomas Rothacher, armasuisse
- Semiconductor-technology as an enabler for modern Defence Systems - Reto Maurer, Rheinmetall President SWISS ASD
10:20-10:50
Coffee break & Networking
10:50-12:00
Session 2: Trends, challenges and opportunities for the Swiss industry in chip design
- Keynote: World’s fastest AI inference with Wafer Scale Engine. Against all odds - Jean-Philippe Fricker, Cerebras
- From Miniaturization to Full Solutions: Navigating Innovation and Challenges in Chip Design for Sensors - Dr. Thomas Uehlinger, Sensirion
- Niche Beats Scale: Ultra-Low-Power CMOS with a Swiss Fab and a Global Footprint - Peter Brandt, EM Microelectronics
- Building a deep-tech semiconductor company in Switzerland - Amin Shokrollahi, Kandou
- Followed by moderated Q&A with audience (Moderator: Alain-Serge Porret)
12:00-13:15
Lunch
13:15-14:35
Session 3: Trends, challenges and opportunities for the Swiss industry in metrology along the semiconductor value chain
- Keynote: Inspection and Metrology challenges in Semiconductor Advanced Packaging - Thierry Eme, Cohu
- Building a Swiss Innovation Ecosystem focused on Semiconductor Metrology & Inspection - Procopios Constantinou, PiA Metrology / Park Innovaare
- Motion System Solutions for Metrology and Inspection Challenges in Semiconductor Manufacturing - Hervé Stämpfli, ETEL
- Closing the Metrology Gaps in Contamination Control at Front-end Manufacturing of Leading-Edge Semiconductors - Ario Cocina, Unisers
- How Robust Nanoscale Metrology is Mission-Critical for Semiconductor Manufacturing - Dominik Ziegler, Nanosurf
- Followed by moderated Q&A with audience (Moderator: Yasin Ekinci)
14:35-15:05
Coffee break & Networking
15:05-16:15
Session 4: Trends, challenges and opportunities for the Swiss industry in advanced packaging
- Keynote: Novel solutions from ZEISS supporting Advanced Packaging technology needs - Martin Dietzel, Zeiss SMT
- Si & SiC power semiconductor packaging - Baseline for our power grid today and in the future - Tobias Keller, Hitachi Energy
- Advanced Packaging as a Multi-Domain Engineering and Control Problem - Rok Vintar, Cosylab
- Advanced Packaging & Heterogeneous Integration: Opportunities for Switzerland’s Semiconductor Industry - Silvio Muschter, Swissbit
- Followed by moderated Q&A with audience (Moderator: Cemal Aydogan)
16:15-16:45
Panel Discussion: The real opportunities for the Swiss semiconductor industry facing the current global trend and conditions:
Speakers:
- Seraina Frost, SECO
- Jean-Philippe Fricker, Cerebras
- Thierry Eme, Cohu
- M. Dietzel , Zeiss SMT
- A.-S. Porret, CSEM
Moderator: Hans Priem
16:45-17:00
Concluding remarks
- The Swiss Semiconductur Day today and in the future - C. Aydogan / A. Spierings
17:00-18:30
Apero & Networking