Program

Information regarding the speakers and presentation titles will be announced shortly.

09:00-09:15
Introduction

09:15-10:15
Session 1: Geopolitical Aspects impacting the semiconductor industry

• Securing Semiconductor Exports under Swiss and Global Trade Rules - Seraina Frost, SECO
• Securing the Global Supply Chain in the Era of Increased Geopolitical Competition - Ivan Zaccagnini, ETH-CSS
• Military trends and needs for semiconductor solutions - Thomas Rothacher, armasuisse
• Opportunities and needs from an industrial perspective - Reto Maurer, Rheinmetall President SWISS ASD
   

10:15-10:45
Coffee break & Networking

10:45-12:00
Session 2: Trends, challenges and opportunities for the Swiss industry in chip design

• World’s fastest AI inference with Wafer Scale Engine. Against all odds - Jean-Philippe Fricker, Founder and Chief System Architect
• From Miniaturization to Full Solutions: Navigating Innovation and Challenges in Chip Design for Sensors - Dr. Thomas Uehlinger Head R&D ASIC
• Niche Beats Scale: Ultra-Low-Power CMOS with a Swiss Fab and a Global Footprint - Peter Brand, VP Development
• Building a deep-tech semiconductor company in Switzerland - Amin Shokrollahi, Kandou
• Followed by moderated Q&A with audience (Moderator: Alain-Serge Porret)

12:00-13:15
Lunch

13:15-14:35
Session 3: Trends, challenges and opportunities for the Swiss industry in metrology along the semiconductor value chain

• Building a Swiss Innovation Ecosystem focused on Semiconductor Metrology & Inspection - Procopios Constantinou / Christian Brönnimann, PiA Metrology / Park Innovaare
• Motion System Solutions for Metrology and Inspection Challenges in Semiconductor Manufacturing - Hervé Stämpfli, Head of Product Management, ETEL
• Closing the Metrology Gaps in Contamination Control at Front-end Manufacturing of Leading-Edge Semiconductors - Ali Altun, Unisers
• Title tbd. - Dominik Ziegler, Nanosurf
• Followed by moderated Q&A with audience (Moderator: Yasin Ekinci)

14:35-15:05
Coffee break & Networking

15:05-16:15
Session 4: Trends, challenges and opportunities for the Swiss industry in advanced packaging

• Novel solutions from ZEISS supporting Advanced Packaging technology needs - Martin Dietzel (Director Product Strategy), Zeiss SMT
• Si & SiC power semiconductor packaging - Baseline for our power grid today and in the future - Tobias Keller, Hitachi Energy
• Title tbd. - Tadej Pukl, Cosylab
• Title tbd. - Silvio Muschter, Swissbit
• Followed by moderated Q&A with audience (Moderator: Cemal Aydogan)

16:15-16:45
Panel Discussion: The real opportunities for the Swiss semiconductor industry facing the current global trend and conditions:

Speakers:

• Seraina Frost, SECO
• Jean-Philippe Fricker, Cerebras
• André Grede, Comet AG
• M. Dietzel , Zeiss SMT

Moderator: Hans Priem

16:45-17:00
Concluding remarks

• The Swiss Semiconductur Day today and in the future - C. Aydogan / A. Spierings

17:00-18:30
Apero & Networking