Swiss Chip Alliance Members Infrastructure Contact

Members

The Swiss Chip Alliance is a networking platform uniting Swiss clean room facility operators in the field of photonics and semiconductor development.

The Swiss Chip Alliance serves as an information exchange platform to identify and align focus areas and investment priorities, and it networks with national and international platforms, politics and industrial stakeholders.

BRNC

The Binnig and Rohrer Nanotechnology Center (BRNC) is a state-of-the-art nanotechnology R&D platform enabling innovation from concept to prototype and offering:  

  • Advanced cleanroom infrastructure (ISO 5–7) covering the full fabrication chain from lithography to etching, thermal processing, deposition, back-end and advanced metrology and characterization.  
  • Unique ultra-stable noise-free lab e-beam lithography environment for highest resolution and overlay accuracy.  
  • Expert support and services for process development, complex workflows, and user training.  
  • Collaboration and innovation for research projects with academic, industrial, and start-up partners. 
  • Fast turnaround and high flexibility in materials and wafer sizes. 

BRNC has a very broad application scope spanning electronics, photonics, quantum technologies, MEMS, biomedical systems, and advanced materials, with a multidisciplinaryexperienced team supporting research, R&D and prototyping processes.

Learn more on our website: https://brnc.ethz.ch/

ETHZ – BRNC, Rueschlikon
Dr. Eva De Leo  Eva (BRNC)  
RSA
Säumerstrasse 4 
8803 Rüschlikon
Switzerland

eva.deleonoSpam@ethz.ch
T: +41 44 632 07 38
 

EPFL CMI

The Center of MicroNanoTechnology (CMi) is a world-class research platform operating 1,800 m² of ISO 5 to 7 cleanroom space, dedicated to micro- and nano-fabrication. It provides access to over 150 advanced fabrication tools, including e-beam and DUV lithography, PVD, CVD, dry and wet etching, and metrology, enabling the fabrication of structures down to 10 nm on 100 mm and 150 mm wafers. Supported by a 25-member expert staff, CMi centralizes technological know-how, offers personalized daily assistance, and trains users to become autonomous in their projects. The center fosters multidisciplinary innovation and international collaboration across fields such as MEMS, photonics, quantum technologies, materials science, biology, medicine, and nanotechnology. In the Swiss Chip Alliance strategy, EPFL-CMi is identified as a flagship facility to provide 200 mm process capabilities in the coming years. 

Learn more on our website:  ???

EPFL CMI
Dr. Philippe FlĂĽckiger / Guillermo Villanueva (????)
BM 1124 (Bâtiment BM)
Station 17
1015 Lausanne
Switzerland

philippe.fluckigernoSpam@epfl.ch
T: +41 21 693 57 33
 

Services offered

  • Renting cleanroom space: No
  • Using fabrication, testing and characterization tools (by trained external users): Yes
  • Fabrication, testing and characterization services: Limited
  • Foundry services (including own PDKs and IP blocks): Indirectly
  • Project-based collaborations: Indirectly

CSEM

CSEM is a Swiss technology innovation center developing advanced technologies with a high societal impact, which it then transfers to industry to strengthen the economy. The non-profit orientated, public-private organization is internationally recognized, and works to support the disruptive activities of companies in Switzerland and abroad. CSEM operates in the domains of precision manufacturing, digitalization, and sustainable energy. To accomplish its mission as gateway between research and economy, CSEM's more than 600 employees from 45 countries collaborate with leading universities, scientific institutions, research institutes, and industrial partners.

Learn more on our website: Industrial Research and Development | Technological Innovation

CSEM
Olivier Dubochet
Rue Jaquet-Droz 1
2000 Neuchâtel
Switzerland

Olivier.dubochetnoSpam@csem.ch
T: +41 32 720 51 11
 

Services offered

  • Advanced microfabrication services 
    Fabrication of MEMS, photonics, quantum and biomedical devices in a state‑of‑the‑art ISO 5–6 cleanroom environment.
  • Custom process development and integration 
    Design and implementation of tailored process flows using a wide range of materials and technological modules.
  • End‑to‑end project execution 
    Full service from concept development, prototyping and characterisation to industrialization and small‑ and medium-scale production.
  • Industrial‑grade, certified manufacturing 
    Closed service model operated by expert staff in an ISO9001‑certified environment, ensuring quality, confidentiality and reproducibility. 

Special focus / expertise

CSEM microfabrication platform offers unique expertise at the intersection of MEMS, photonics, quantum technologies and bio-medical devices, enabling the development of advanced, application‑driven devices beyond standard processes. Our strength lies in combining diverse technological building blocks within a flexible, industrial‑grade environment to bridge the gap from research concepts to manufacturable products.

In the MEMS domain, we develop complex, high‑mix / low‑volume devices by combining silicon micromachining, advanced material platforms such as SiC, TFLN, TFLT and piezoelectric thin films, and heterogeneous integration. This approach enables the realization of sensors, actuators and precision mechanisms tailored to demanding operating environments and application‑specific requirements.

We develop advanced Photonic Integrated Circuit (PIC) solutions by combining material-platform expertise, process integration and device fabrication capabilities. With dedicated platforms including TFLN, TFLT and SiCOI, we support the realization of high-performance photonic components for data communication, sensing, quantum technologies and emerging computing architectures.

Our expertise further extends to micro‑ and nano‑optics, where precision fabrication, multi‑material integration and advanced patterning are combined to realize wafer‑level optical systems. In parallel, we are expanding our capabilities in quantum technologies by supporting the fabrication of novel devices and material platforms for next‑generation sensing, communication and computing systems.

CSEM strength lies in combining diverse technological building blocks within a flexible, industrial‑grade environment to bridge the gap from basic research to manufacturable products. 

Sensor Innovation Hub

Research and technology transfer center for sensor applications, miniaturized systems, photonic technologies and system integration. 

Our focus is on application-oriented research and implementation — transferring research results into products through collaborative projects with industry. 

Our cutting-edge infrastructure — openly accessible to industry and academia — covers the full path from R&D to pilot-scale manufacturing. Our vision is to establish a 200 mm wafer pilot line that bridges the gap between laboratory feasibility and industrial volume production: qualified, industry-compatible processes on standard 200 mm substrates, enabling prototyping, preliminary series and low-volume production under production-like conditions. 

By offering this capability as an open-access platform, we lower the entry barriers for SMEs and corporations to adopt these advanced technologies for future product generations. 

Sensor Innovation Hub
OST – Ostschweizer Fachhochschule
Marco Cucinelli
Werdenbergstrasse 4
9471 Buchs SG
Switzerland

marco.cucinellinoSpam@ost.ch
T: +41 58 257 34 57

 

Paul Scherrer Institute PSI

The Park Innovaare Cleanroom for Optics and Innovation (PICO) is the modern, 450m² large ISO 5 and ISO 6 cleanroom facility of Paul Scherrer Institute, enabling the academic research as well as the R&D projects of startups and SMEs. It is providing access to the modern nanofabrication tools supporting the processing on the wafers up to 200mm diameter. A team of 9 staff members are training, advising and supporting the users with their projects in the dynamic field of nanotechnology, photonics, quantum technologies, X-ray optics, materials science, biology, and many others.

Letzte Aktualisierung: 03.06.2026